接口 - 传感器和探测器接口

ZSC31050FAC

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSC31050FAC.pdf

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ZSC31050FEC

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSC31050FEC.pdf

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ZSC31050FIC

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSC31050FIC.pdf

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ZSC31150GAC

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSC31150GAC.pdf

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ZSC31150GEC

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSC31150GEC.pdf

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ZSSC3015NA1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书:

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ZSSC3015NA1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书:

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ZSSC3015NE1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3015NE1B.pdf

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ZSSC3015NE1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3015NE1C.pdf

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ZSSC3015NE1D

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书:

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ZSSC3016CC1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3016CC1B.pdf

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ZSSC3016CC1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3016CC1C.pdf

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ZSSC3016CC6B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3016CC6B.pdf

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ZSSC3016CI1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3016CI1B.pdf

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ZSSC3016CI1BP

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3016CI1BP.pdf

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ZSSC3016CI1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3016CI1C.pdf

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ZSSC3016CI6B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3016CI6B.pdf

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ZSSC3016DI1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3016DI1B.pdf

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ZSSC3016DI6B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3016DI6B.pdf

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ZSSC3018BA2C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3018BA2C.pdf

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ZSSC3018BA2D ES

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书: ZSSC3018BA2D ES.pdf

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ZSSC3026CC1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3026CC1C.pdf

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ZSSC3026CC6C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3026CC6C.pdf

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ZSSC3026CI1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3026CI1C.pdf

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ZSSC3026CI1D ES

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书: ZSSC3026CI1D ES.pdf

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ZSSC3026CI6C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3026CI6C.pdf

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ZSSC3036CC1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3036CC1C.pdf

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ZSSC3036CI1D ES

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书: ZSSC3036CI1D ES.pdf

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ZSSC3122AA1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3122AA1B.pdf

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ZSSC3122AA1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3122AA1C.pdf

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ZSSC3122AI1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3122AI1B.pdf

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ZSSC3122AI1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3122AI1C.pdf

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ZSSC3123AA1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3123AA1C.pdf

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ZSSC3123AI1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3123AI1C.pdf

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ZSSC3131BA1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3131BA1B.pdf

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ZSSC3131BA1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3131BA1C.pdf

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ZSSC3131BA1D

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书: ZSSC3131BA1D.pdf

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ZSSC3131BE1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3131BE1B.pdf

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ZSSC3131BE1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3131BE1C.pdf

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ZSSC3131BE1D

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书: ZSSC3131BE1D.pdf

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ZSSC3135BA1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3135BA1C.pdf

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ZSSC3135BE1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3135BE1C.pdf

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ZSSC3136BA1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3136BA1B.pdf

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ZSSC3136BA1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3136BA1C.pdf

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ZSSC3136BA1D

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书: ZSSC3136BA1D.pdf

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ZSSC3136BE1B

制造商:IDT, Integrated Device Technology Inc

描述: WAFER (UNSAWN) - BOX

规格书: ZSSC3136BE1B.pdf

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ZSSC3136BE1C

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - FRAME

规格书: ZSSC3136BE1C.pdf

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ZSSC3136BE1D

制造商:IDT, Integrated Device Technology Inc

描述: DICE (WAFER SAWN) - WAFFLE PACK

规格书: ZSSC3136BE1D.pdf

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